Solid freeform fabrication of lightweight lithography stage

ABSTRACT

The invention provides a method of making an EUV lithography stage structure for use in a semiconductor microlithography with EUV (extreme ultraviolet) radiation, where the stage is utilized to hold and support a substrate such as a mask or wafer. The invention includes providing a Ti doped SiO 2  glass powder; providing a binder, said binder for binding the glass powder together; depositing a layer of the glass powder in a confined region to provide an underlying layer; applying the binder to one or more selected regions of the layer of glass powder to bind at least two glass particles together to form a primitive with the binder bonding the glass powder together at the one or more selected regions; depositing an above layer of the glass powder above the deposited layer; applying the binder to one or more selected regions of the above layer with the binder bonding the glass powder together at the one or more selected regions; repeating the steps of depositing an above layer and applying a binder thereto for a selected number of times to produce a selected number of successive layers with said binder bonding said successive layers together; and removing the unbonded glass powder which is not at said one or more selected regions to provide a bonded glass powder lithography stage structure which is then sintered and densified into a densified nonpowder glass lithography stage.

FIELD OF THE INVENTION

[0001] The invention relates to stages for use in projectionmicrolithography. The invention is particularly related to stages foruse in projection lithography employing short wavelength radiation. Theinvention is particularly related to stages for use in extremeultraviolet (EUV) lithography systems.

BACKGROUND

[0002] The use of extreme ultraviolet soft x-ray radiation providesbenefits in terms of achieving smaller feature dimensions but due to thenature of the radiation, it presents difficulties in terms ofmanipulating and directing such wavelengths of radiation and has delayedthe commercial lithographic manufacturing use of such radiation.

[0003] The present invention provides for an economically manufacturedlightweight support stage that is stable and provides an improvedextreme ultraviolet soft x-ray based projection lithographymethod/system. The present invention economically provides for themaking of support stages for use in projection lithography method/systemto support components of the process such as a mask or wafer. Thepresent invention economically provides for the making of supportstructure stages for use in extreme ultraviolet soft x-ray basedprojection lithography method/system to support components andsubstrates of the process such as optics, reflective members, mirrors,masks or wafers.

[0004] Projection lithography is a powerful and essential tool formicroelectronics processing and Extreme UltraViolet (EUV) is now at theforefront of research in efforts to achieve smaller and smaller desiredfeature sizes on wafers. With projection photolithography, a mask isimaged through a reduction-projection lens onto a wafer. Masks for EUVprojection lithography typically comprise a substrate coated with anx-ray reflective material and a pattern fabricated from an x-rayabsorbing material that is formed on the reflective material. Inoperation, EUV radiation from the condenser is projected toward thesurface of the mask and radiation is reflected from those areas of themask reflective surface which are exposed, i.e., not covered by thex-ray absorbing material. The reflected radiation effectivelytranscribes the pattern from the mask to the wafer positioned downstreamfrom the mask. A scanning exposure device uses simultaneous motion ofthe mask and wafer, with each substrate being mounted on a chuck that isattached to an X-Y stage platen, to continuously project a portion ofthe mask onto the wafer through projection optics. Scanning, as opposedto exposure of the entire mask at once, allows for the projection ofmask patterns that exceed in size that of the image field of theprojection lens. Mirrors are mounted along the sides of a stage; andinterferometer heads that direct laser beams onto the associated mirrorsand detect the beam reflection therefrom are employed for positionmeasuring purposes. Movement of the stage is accomplished with motorizedpositioning devices. A stage similarly supports the wafer substrate.

SUMMARY OF THE INVENTION

[0005] The invention includes a method of making a lithography stage.The method includes providing a Ti doped SiO₂ glass powder comprised ofa plurality of particles of Ti doped SiO₂ glass; providing a binder,said binder for binding said Ti doped SiO₂ glass particles together;depositing a layer of said Ti doped SiO₂ glass powder in a confinedregion to provide an underlying layer; applying said binder to one ormore selected regions of said layer of Ti doped SiO₂ glass powder tobind at least two of said Ti doped SiO₂ glass particles together to forma primitive, said applying binder bonding said glass powder together atsaid one or more selected regions; depositing an above layer of said Tidoped SiO₂ glass powder above said deposited layer; applying said binderto one or more selected regions of said above layer with said binderbonding said glass powder together at said one or more selected regions;repeating the steps of depositing an above layer and applying a binderthereto for a selected number of times to produce a selected number ofsuccessive layers with said binder bonding said successive layerstogether; and removing the unbonded glass powder which is not at saidone or more selected regions to provide a bonded Ti doped SiO₂ glasspowder lithography stage structure.

[0006] The method includes a method of making a lithography stage. Themethod include providing a plurality of glass particles; providing abinder, said binder for binding said glass particles together;depositing a layer of said glass particles in a confined region toprovide an underlying layer; applying said binder to one or moreselected regions of said layer of glass particles to bind at least twoof said glass particles together to form a primitive, said applyingbinder bonding said glass particles together at said one or moreselected regions; depositing an above layer of said glass particlesabove said deposited layer; applying said binder to one or more selectedregions of said above layer with said binder bonding said glassparticles together at said one or more selected regions; repeating thesteps of depositing an above layer and applying a binder thereto for aselected number of times to produce a selected number of successivelayers with said binder bonding said successive layers together;removing unbonded glass particles which are not at said one or moreselected regions to provide a bonded glass particle lithography stagestructure.

[0007] The invention includes method of making an EUV lithographystructure, said method comprising the following steps: providing aplurality of glass particles; providing a binder, said binder forbinding said glass particles together; depositing a layer of said glassparticles in a confined region to provide an underlying layer; applyingsaid binder to one or more selected regions of said layer of glassparticles to bind at least two of said glass particles together to forma primitive, said applying binder bonding said glass particles togetherat said one or more selected regions; depositing an above layer of saidglass particles above said deposited layer; applying said binder to oneor more selected regions of said above layer with said binder bondingsaid glass particles together at said one or more selected regions;repeating the steps of depositing an above layer and applying a binderthereto for a selected number of times to produce a selected number ofsuccessive layers with said binder bonding said successive layerstogether; removing unbonded glass particles which are not at said one ormore selected regions to provide a bonded glass particle EUV lithographystructure.

[0008] Additional features and advantages of the invention will be setforth in the detailed description which follows, and in part will bereadily apparent to those skilled in the art from that description orrecognized by practicing the invention as described herein, includingthe detailed description which follows, the claims, as well as theappended drawings.

[0009] It is to be understood that both the foregoing generaldescription and the following detailed description are merely exemplaryof the invention, and are intended to provide an overview or frameworkfor understanding the nature and character of the invention as it isclaimed. The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate various embodimentsof the invention, and together with the description serve to explain theprincipals and operation of the invention.

BRIEF DESCRIPTION OF DRAWINGS

[0010]FIG. 1 shows a semiconductor lithography stage in accordance withthe invention.

[0011]FIG. 2 shows a semiconductor lithography stage in accordance withthe invention.

[0012] FIGS. 3-15 show methods of making semiconductor lithographystructures in accordance with the invention.

[0013]FIG. 16 shows a cross-section view of a semiconductor lithographystage in accordance with the invention.

[0014]FIG. 16A shows the A-A view of the semiconductor lithography stageof FIG. 16 in accordance with the invention.

[0015]FIG. 16B shows the B-B view of the semiconductor lithography stageof FIG. 16 in accordance with the invention.

[0016]FIG. 16C shows the C-C view of the semiconductor lithography stageof FIG. 16 in accordance with the invention.

[0017]FIG. 16D shows the D-D view of the semiconductor lithography stageof FIG. 16 in accordance with the invention.

DETAILED DESCRIPTION

[0018] The invention includes a method of making a semiconductorlithography stage. The lithography stages of the invention providesupport and holding of components and substrates such as optics,reflective members, mirrors, masks or wafers in a semiconductormanufacturing projection lithography system. Preferably the lithographystage is for receiving a patterned lithography mask or a silicon waferthat is the subject target of the micro-lithography process. Preferablythe lithography stage is a EUV lithography stage utilized in an EUVlithography system to receive and hold a patterned lithography mask or asilicon wafer that is the subject target of the micro-lithographyprocess. The method of making the lithography stage includes the stepsof providing a Ti doped SiO₂ glass powder comprised of a plurality ofparticles of Ti doped SiO₂ glass and providing a binder for binding saidTi doped SiO₂ glass particles together. Preferably the glass powderparticles are non-crystalline glass particles, most preferably with theglass being silica containing a predetermined amount of TiO₂. The methodincludes depositing a layer of said Ti doped SiO₂ glass powder in aconfined region to provide an underlying layer and applying said binderto one or more selected regions of said layer of Ti doped SiO₂ glasspowder to bind at least two of said Ti doped SiO₂ glass particlestogether to form a primitive. The application of binder includes bondingsaid glass powder together at said one or more selected regions. Themethod includes depositing an above layer of said Ti doped SiO₂ glasspowder above said deposited layer and applying said binder to one ormore selected regions of said above layer with said binder bonding saidglass powder together at said one or more selected regions. The methodinclude repeating the deposition of Ti doped SiO₂ glass powder andapplication of binder to selected regions for a selected number of timesto produce a selected number of successive layers with said binderbonding said successive layers together. The method includes removingthe unbonded glass powder which is not at said one or more selectedregions from the bonded glass powder regions to provide a bonded Tidoped SiO₂ glass powder lithography stage structure. The methodpreferably includes sintering said bonded Ti doped SiO₂ glasslithography stage structure into a densified glass lithography stagestructure. The bonded Ti doped SiO₂ glass powder lithography stagestructure is sintered into a glass body which has its structural form.Preferably sintering into a densified glass lithography stage structureincludes sintering at a temperature of at least 1100° C., preferably ata temperature no greater than 1700° C., and most preferably at atemperature in the range of 1200 to 1550° C. In a preferred embodimentthe glass powder structure is sintered in a vacuum furnace atmosphere.Forming the Ti doped SiO₂ glass powder lithography stage structure intoa densified glass lithography stage structure preferably includes hotisostatic pressing. Hot isostatic pressing can be done as part of thesintering process when a HIP furnace is utilized for sintering. Hotisostatic pressing is preferably preceded by the use of a heated vacuumatmosphere. Preferably applying said binder includes depositing saidbinder to form an internal skeletal network frame for the stage.Preferably forming a skeletal network includes forming a web structurewith a wall thickness≦2 mm. In preferred ultrathin wall structure lightweight embodiments the wall thickness≦1 mm, and more preferably a wallthickness≦0.5 mm. Preferably applying said binder includes depositingsaid binder to form a lithography wafer receiver surface, preferablywith depositing said binder to form a skeletal network frame for saidlithography wafer receiver. Preferably depositing said binder to form alithography wafer receiver includes forming a flat planar surface. In afurther embodiment, applying said binder includes depositing said binderto form a lithography mask receiver, preferably with a flat planarsurface which has an underlying internal skeletal network frame. In afurther embodiment, applying said binder includes depositing said binderto form a flat mirror surface, which can be used in the lithographyprocess to optically detect the position of the stage. In a preferredembodiment the flat mirror surface is machined, polished and formed intoa high precision reflective mirror after sintering and densification.Preferably the Ti doped SiO₂ glass powder contains 3 to 20 wt. % TiO₂,more preferably 5 to 20 wt. % TiO₂, and most preferably 5 to 10 wt. %TiO₂. In a preferred embodiment, providing a binder comprises providinga mixture of H₂O and Ti doped SiO₂ glass soot, most preferably whereinsaid mixture of water and Ti doped SiO₂ glass soot includes ammonia. Inan embodiment of the method, providing a Ti doped SiO₂ glass powderincludes providing a conglomerated Ti doped SiO₂ glass powderagglomerate comprised a plurality of cemented together primary glassparticles, preferably with the glass powder being dry macro-particleswhich are glass micro-particles that are bond together with a binder,most preferably wherein said primary glass particles are cementedtogether with an organic binder, preferably PEG. With such an embodimentproviding a binder preferably comprises providing a water binder, saidwater binder for reactivating said organic binder.

[0019] Glass powders with improved packing density and flow behavior areprovided by spray drying. Spray drying glass powders can be carried outby first, dispersing Ti doped glass soot in a water/ammonia solution.The solution is then pumped through an atomizing nozzle into a heatedchamber to produce typically spherical dried powder agglomerates. Theglass powder dried agglomerates flow well and have a relatively high(>25%) bulk density of about 30 to 40%.

[0020] Alternatively, binders can be used such as PEG, PVA or PVOHduring the spray drying process. Typically, the binder content isminimized to minimize contamination from the organic components.

[0021] An alternative to spray drying includes freeze drying. This canbe done by spraying an atomized mist of the slurry into liquid nitrogenand then freeze drying the frozen droplets.

[0022] Preferably applying said binder to selected regions includesprojecting a plurality of binder droplets from a binder deposition head,most preferably with applying said binder to selected regions by ink jetprint depositing said binder. Preferably the projected droplets have adiameter≧50 microns, and more preferably the droplets have a diameter of80±15 microns. Preferably the binder is deposited in select areas byproviding relative motion between said binder deposition head and saiddeposited layer of glass powder and controlling the output of binderdroplets. Preferably depositing said Ti doped I glass powder includesdepositing with a powder distribution head. Preferably the Ti doped SiO₂glass powder has an average particle size≧10 microns, preferably≧20microns, and more preferably the Ti doped SiO₂ glass powder has anaverage particle size≧30 microns.

[0023] Embodiments of the invention are shown in the FIGS. 1-16D, whichshow a semiconductor lithography stage 20 and a method of making.Preferably the lithography stage 20 is for receiving a patternedlithography mask or a silicon wafer 21 that is the subject target of themicro-lithography process. As shown in FIGS. 3-4 the method of makingthe lithography stage 20 includes the steps of providing a Ti doped SiO₂glass powder 22 comprised of a plurality of particles 23 of Ti dopedSiO₂ glass and providing a binder 24 for binding said Ti doped SiO₂glass particles 23 together. Preferably the glass powder particles 23are non-crystalline glass particles. As shown in FIGS. 5-7, the methodincludes depositing a layer of said Ti doped SiO₂ glass powder 22 in aconfined region to provide an underlying layer and applying said binder24 to one or more selected regions 25 of said layer of Ti doped SiO₂glass powder 22 to bind at least two of said Ti doped SiO₂ glassparticles 23 together to form a primitive. The application of binder 24includes bonding said glass powder 22 together at said one or moreselected regions 25. The method includes depositing an above layer ofsaid Ti doped SiO₂ glass powder 22 above said deposited layer andapplying said binder 24 to one or more selected regions 25 of said abovelayer with said binder bonding said glass powder together at said one ormore selected regions. As shown in FIGS. 9-12, the method includerepeating the deposition of Ti doped SiO₂ glass powder 22 andapplication of binder 24 to selected regions 25 for a selected number oftimes to produce a selected number of successive layers with said binderbonding said successive layers together. As shown in FIG. 13, the methodincludes removing the unbonded glass powder 22 which is not at said oneor more selected regions from the bonded glass powder regions 25 toprovide a bonded Ti doped SiO₂ glass powder lithography stage structure30. As shown in FIGS. 14-15, the method preferably includes sinteringsaid bonded Ti doped SiO₂ glass lithography stage structure 30 into adensified glass lithography stage structure 31. The bonded Ti doped SiO₂glass powder lithography stage structure 30 is sintered into a glassbody 31 which has its structural form. Preferably sintering into adensified glass lithography stage structure 31 includes sintering in aglass sintering furnace 32 at a temperature of at least 1100° C.,preferably at a temperature no greater than 1700° C., and mostpreferably at a temperature in the range of 1200 to 1550° C. In apreferred embodiment the glass powder structure is sintered in a vacuumfurnace atmosphere 33. Forming the Ti doped SiO₂ glass powderlithography stage structure into a densified glass lithography stagestructure preferably includes hot isostatic pressing. Hot isostaticpressing can be done as part of the sintering process when a HIP furnace32 is utilized for sintering. Hot isostatic pressing is preferablypreceded by the use of a heated vacuum atmosphere 32. FIG. 16 shows across-section view of stage 20, with FIGS. 16A-16D showing horizontallayer cuts through its structure. Preferably applying said binder 24includes depositing said binder 24 to form an internal skeletal networkframe 40 for the stage. Preferably forming a skeletal network 40includes forming a web structure 42 with a wall thickness≦3 mm. Inembodiments the skeletal network structure has wall thickness≦2 mm, morepreferably a wall thickness≦1 mm, and more preferably a wallthickness≦0.5 mm. Preferably applying said binder 24 includes depositingsaid binder 24 to form a lithography wafer receiver surface 43,preferably with depositing said binder to form a skeletal network frame40 for said lithography wafer receiver. Preferably depositing saidbinder 24 to form a lithography wafer receiver 43 includes forming aflat planar surface. In a further embodiment, applying said binder 24includes depositing said binder to form a lithography mask receiver 43,preferably with a flat planar surface which has an underlying internalskeletal network frame 40. In a further embodiment, applying said binderincludes depositing said binder to form a flat mirror surface 50, whichcan be used in the lithography process to optically detect the positionof the stage with the flat surface polished and formed into a reflectingmirror after sintering and densification. Forming a flat mirror surface50 preferably includes forming at least two flat mirror surfaces on atleast two sides of the stage, preferably on two nonparrallel adjacentsides for use in optically detecting the position of the stage duringuse of the lithography system. Preferably the Ti doped SiO₂ glass powder22 contains 3 to 20 wt. % TiO₂, more preferably 5 to 20 wt. % TiO₂, andmost preferably 5 to 10 wt. % TiO₂. In a preferred embodiment, providinga binder 24 comprises providing a mixture of H₂O and Ti doped SiO₂ glasssoot, most preferably wherein said mixture of water and Ti doped SiO₂glass soot includes ammonia. In an embodiment of the method, providing aTi doped SiO₂ glass powder 22 includes providing a conglomerated Tidoped SiO₂ glass powder comprised a plurality of cemented togetherprimary glass particles 23, preferably with the glass powder being drymacro-particles 23 which are glass micro-particles that are bondtogether with a binder, most preferably wherein said primary glassparticles are cemented together with an organic binder, preferably PEG.With such an embodiment providing a binder 24 preferably comprisesproviding a water binder, said water binder for reactivating saidorganic binder.

[0024] Preferably applying said binder 24 to selected regions includesprojecting a plurality of binder droplets 60 from a binder depositionhead 61, most preferably with applying said binder to selected regionsby ink jet print depositing said binder 24. Preferably the projecteddroplets 60 have a diameter≧50 microns, and more preferably the droplets60 have a diameter of 80±15 microns. Preferably the binder 24 isdeposited in select areas by providing relative motion between saidbinder deposition head 61 and said deposited layer of glass powder 22and controlling the output of binder droplets 60. Preferably depositingsaid Ti doped glass powder 22 includes depositing with a powderdistribution head 70. Preferably the Ti doped SiO₂ glass powder 22 hasan average particle size≧10 microns, preferably≧20 microns and morepreferably the Ti doped SiO₂ glass powder 22 has an average particlesize≧30 microns.

[0025] The invention includes making a lithography stage by providing aplurality of glass particles; providing a binder, said binder forbinding said glass particles together; depositing a layer of said glassparticles in a confined region to provide an underlying layer; applyingsaid binder to one or more selected regions of said layer of glassparticles to bind at least two of said glass particles together to forma primitive, said applying binder bonding said glass particles togetherat said one or more selected regions; depositing an above layer of saidglass particles above said deposited layer; applying said binder to oneor more selected regions of said above layer with said binder bondingsaid glass particles together at said one or more selected regions;repeating depositing an above layer and applying a binder a selectednumber of times to produce a selected number of successive layers withsaid binder bonding said successive layers together; and removingunbonded glass particles which are not at said one or more selectedregions to provide a bonded glass particle lithography stage structure.The bonded glass particle lithography stage structure is heated andsintered into a densified glass lithography stage structure.

[0026] The invention includes making an EUV lithography structure byproviding a plurality of glass particles; providing a binder, saidbinder for binding said glass particles together; depositing a layer ofsaid glass particles in a confined region to provide an underlyinglayer; applying said binder to one or more selected regions of saidlayer of glass particles to bind at least two of said glass particlestogether to form a primitive, said applying binder bonding said glassparticles together at said one or more selected regions; depositing anabove layer of said glass particles above said deposited layer; applyingsaid binder to one or more selected regions of said above layer withsaid binder bonding said glass particles together at said one or moreselected regions; repeating depositing an above layer and applying abinder a selected number of times to produce a selected number ofsuccessive layers with said binder bonding said successive layerstogether; and removing unbonded glass particles which are not at saidone or more selected regions to provide a bonded glass particle EUVlithography structure. The bonded glass particle EUV lithographystructure is heated and densified into a densified EUV lithographystructure.

[0027] In an embodiment of the invention, providing glass particlescomprises providing a TiO₂ containing silica glass. In an alternativepreferred embodiment the glass particles are a high purity fused silicaglass. In a preferred embodiment, the Ti doped SiO₂ glass particlescontains from 5 to 10 wt. % TiO₂, most preferably with the TiO₂ silicaglass having an OH content>100 ppm OH wt., more preferably>500 ppm OHwt, preferably with the silica glass being a glass which consistsessentially of SiO₂ and TiO₂. In a particularly preferred embodiment theTiO₂ silicon dioxide silica glass particles contains from 6 to 8 wt. %,more preferably form 6.5 to 7.5 wt. %, and most preferably about 7 wt. %TiO₂. In an embodiment the glass particles are a batch melted glass with<99% SiO₂. In an alternative embodiment the TiO₂ containing silica glassparticles are an uncerammed glass-ceramic precursor glass. In anembodiment providing the glass particles preferably includes providingan uncerammed glass-ceramic precursor glass. In a preferred embodimentthe uncerammed glass-ceramic precursor glass particles are analuminosilicate glass. In an embodiment the uncerammed glass-ceramicprecursor glass particles are a lithium aluminosilicate glass. In anembodiment the uncerammed glass-ceramic precursor glass particlescontain TiO₂. In an embodiment the uncerammed glass-ceramic precursorglass particles contain TiO₂ and ZrO₂. In a preferred embodiment theglass-ceramic precursor glass is a lithium aluminosilicate glass whichcontains TiO₂. In a preferred embodiment the glass-ceramic precursorglass is a lithium aluminosilicate glass which is cerammable into aglass-ceramic with a low average CTE (0-1000° C.) less than about20×10⁻⁷/° C., preferably comprised of 3-8 wt. % Li₂O, 18-33 wt. % Al₂O₃,55-75 wt. % SiO₂, and 3-5 wt. % TiO₂+ZrO₂. In a preferred embodiment theglass-ceramic precursor glass is a lithium aluminosilicate glass whichis cerammable into a glass-ceramic with a mean coefficient of linearthermal expansion of 0±0.10×10⁻⁶/K (0-50° C.), more preferably meancoefficient of linear thermal expansion of 0±0.05×10⁻⁶/K (0-50° C.), andmost preferably mean coefficient of linear thermal expansion of0±0.02×10⁻⁶/K (0-50° C.). Preferably the glass-ceramic precursor lithiumaluminosilicate glass which is cerammable into a glass-ceramic with amean coefficient of linear thermal expansion of 0±0.10×10⁻⁶/K (0-50° C.)has a weight percent composition of about 55.5(±1) wt. % SiO₂, 25.3(±1)wt. % Al₂O₃, 3.7(±1) wt. % Li₂O, 1(±1) wt. % MgO, 1.4(±1) wt. % ZnO,7.9(±1) wt. % P₂O₅, 0.5(±0.5) wt. % Na₂O, 0.03(±0.03) wt. % Fe₂O₃,2.3(±1) wt. % TiO₂, 1.9(±1) wt. % ZrO₂, 0.5(±0.5) wt. % As₂O₃. When theglass particles are a glass-ceramic precursor glass the heating anddensifying into a densified structure preferably includes ceramming theglass into its glass-ceramic state with a ceramming heating coolingschedule for crystal growth.

[0028] It will be apparent to those skilled in the art that variousmodifications and variations can be made to the present inventionwithout departing from the spirit and scope of the invention. Thus, itis intended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. A method of making a lithography stage, said method comprising thefollowing steps: (a) providing a Ti doped SiO₂ glass powder comprised ofa plurality of particles of Ti doped SiO₂ glass; (b) providing a binder,said binder for binding said Ti doped SiO₂ glass particles together; (c)depositing a layer of said Ti doped SiO₂ glass powder in a confinedregion to provide an underlying layer; (d) applying said binder to oneor more selected regions of said layer of Ti doped SiO₂ glass powder tobind at least two of said Ti doped SiO₂ glass particles together to forma primitive, said applying binder bonding said glass powder together atsaid one or more selected regions; (e) depositing an above layer of saidTi doped SiO₂ glass powder above said deposited layer; (f) applying saidbinder to one or more selected regions of said above layer with saidbinder bonding said glass powder together at said one or more selectedregions; (g) repeating steps (e) and (f) a selected number of times toproduce a selected number of successive layers with said binder bondingsaid successive layers together; (h) removing unbonded glass powderwhich is not at said one or more selected regions to provide a bonded Tidoped SiO₂ glass powder lithography stage structure.
 2. A method asclaimed in claim 1, further including sintering said bonded Ti dopedSiO₂ glass lithography stage structure into a densified glasslithography stage structure.
 3. A method as claimed in claim 2 whereinsintering into a densified glass lithography stage structure includessintering at a temperature of at least 1100° C.
 4. A method as claimedin claim 2 wherein sintering into a densified glass lithography stagestructure includes hot isostatic pressing.
 5. A method as claimed inclaim 1, wherein applying said binder includes depositing said binder toform a skeletal network.
 6. A method as claimed in claim 1, whereinapplying said binder includes depositing said binder to form alithography wafer receiver.
 7. A method as claimed in claim 6 whereindepositing said binder to form a lithography wafer receiver includesforming a flat planar surface.
 8. A method as claimed in claim 7 furtherincluding depositing said binder to form a skeletal network frame forsaid lithography wafer receiver.
 9. A method as claimed in claim 1wherein applying said binder includes depositing said binder to form alithography mask receiver.
 10. A method as claimed in claim 1 whereinapplying said binder includes depositing said binder to form a mirrorsurface.
 11. A method as claimed in claim 1 wherein said Ti doped SiO₂glass powder contains 3 to 20 wt. % TiO2.
 12. A method as claimed inclaim 1, wherein providing a binder comprises providing a mixture of H₂Oand Ti doped SiO₂ glass soot.
 13. A method as claimed in claim 12wherein said mixture of H2O and Ti doped SiO₂ glass soot includesammonia.
 14. A method as claimed in claim 1 wherein providing a Ti dopedSiO₂ glass powder includes providing a conglomerated Ti doped SiO₂ glasspowder comprised a plurality of cemented together primary glassparticles.
 15. A method as claimed in claim 14 wherein said primaryglass particles are cemented together with an organic binder.
 16. Amethod as claimed in claim 15 wherein providing a binder comprisesproviding a water binder, said water binder for reactivating saidorganic binder.
 17. A method as claimed in claim 2 wherein sinteringincludes sintering in a vacuum.
 18. A method as claimed in claim 5wherein forming a skeletal network includes forming a web structure witha wall thickness<3 mm.
 19. A method as claimed in claim 1, whereinapplying said binder to selected regions includes projecting a pluralityof binder droplets from a binder deposition head.
 20. A method asclaimed in claim 1 wherein applying said binder to selected regionsincludes ink jet print depositing said binder.
 21. A method as claimedin claim 1 wherein depositing said Ti doped I glass powder includesdepositing with a powder distribution head.
 22. A method as claimed inclaim 1 wherein said Ti doped SiO₂ glass powder has an average particlesize≧10 microns.
 23. A method as claimed in claim 1 wherein said Tidoped SiO₂ glass powder has an average particle size≧20 microns.
 24. Amethod as claimed in claim 19 further including providing relativemotion between said binder deposition head and said deposited layer ofglass powder.
 25. A method of making a lithography stage, said methodcomprising the following steps: (a) providing a plurality of glassparticles; (b) providing a binder, said binder for binding said glassparticles together; (c) depositing a layer of said glass particles in aconfined region to provide an underlying layer; (d) applying said binderto one or more selected regions of said layer of glass particles to bindat least two of said glass particles together to form a primitive, saidapplying binder bonding said glass particles together at said one ormore selected regions; (e) depositing an above layer of said glassparticles above said deposited layer; (f) applying said binder to one ormore selected regions of said above layer with said binder bonding saidglass particles together at said one or more selected regions; (g)repeating steps (e) and (f) a selected number of times to produce aselected number of successive layers with said binder bonding saidsuccessive layers together; removing unbonded glass particles which arenot at said one or more selected regions to provide a bonded glassparticle lithography stage structure.
 26. A method as claimed in claim25, further including sintering said bonded glass particle lithographystage structure into a densified glass lithography stage structure. 27.A method as claimed in claim 26 wherein sintering into a densified glasslithography stage structure includes sintering at a temperature of atleast 1100° C.
 28. A method as claimed in claim 26 wherein sinteringinto a densified glass lithography stage structure includes hotisostatic pressing.
 29. A method of making an EUV lithography structure,said method comprising the following steps: (a) providing a plurality ofglass particles; (b) providing a binder, said binder for binding saidglass particles together; (c) depositing a layer of said glass particlesin a confined region to provide an underlying layer; (d) applying saidbinder to one or more selected regions of said layer of glass particlesto bind at least two of said glass particles together to form aprimitive, said applying binder bonding said glass particles together atsaid one or more selected regions; (e) depositing an above layer of saidglass particles above said deposited layer; (f) applying said binder toone or more selected regions of said above layer with said binderbonding said glass particles together at said one or more selectedregions; (g) repeating steps (e) and (f) a selected number of times toproduce a selected number of successive layers with said binder bondingsaid successive layers together; (h) removing unbonded glass particleswhich are not at said one or more selected regions to provide a bondedglass particle EUV lithography structure.
 30. A method as claimed inclaim 29, further including sintering said bonded glass particlelithography structure into a densified EUV lithography structure.
 31. Amethod as claimed in claim 30 wherein sintering into a densified EUVlithography structure includes sintering at a temperature of at least1100° C.
 32. A method as claimed in claim 30 wherein sintering into adensified EUV lithography structure includes hot isostatic pressing.